2/3/2025 | 3:30 PM - 5:30 PM | Regency B

Invited: Transient thermal characterization of nanoscale devices and 3D heterogeneous integrated circuits

Author(s)

Ali Shakouri | Purdue University

Abstract

Thermal dissipation and heating limit the performance of many state-of-the-art electronic and optoelectronic devices and integrated circuits. Full-field thermoreflectance imaging is used to measure the dynamic temperature of active devices with sub-nanosecond time resolution. Image deconvolution techniques are used to achieve far-field sub-diffraction limit resolution. Evidence for fractal superdiffusion and hydrodynamic transport of heat is presented. Quantum illumination is demonstrated to increase the temperature resolution below shot noise. Pump-probe thermal imaging enables the characterization of passive thin-film materials and buried structures in 3D heterogeneously integrated circuits and packages.